Patents by Inventor Tse SU

Tse SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TUNABLE ANTENNA MODULE

    Publication number: 20210257734

    Abstract: A tunable antenna module includes a ground metal plane, a nonconductive support element, a first radiation metal element, a second radiation metal element, a switch element, and a plurality of impedance elements. The ground metal plane provides a ground voltage. The first radiation metal element is coupled to a signal source. The second radiation metal element is adjacent to and separate from the first radiation metal element. The switch element selects one of the impedance elements, such that the second radiation metal element is coupled through the selected impedance element to the ground voltage. The nonconductive support element has a 3D (Three-Dimensional) structure. The first radiation metal element and the second radiation metal element are distributed over the nonconductive support element.

    Type: Application

    Filed: November 23, 2020

    Publication date: August 19, 2021

    Inventors: Tse SU, Chung-Yen HSIAO, Huang-Tse PENG

  • METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

    Publication number: 20210013158

    Abstract: A method for manufacturing a semiconductor package includes following operations. A die having a first surface and a second surface opposite to the first surface is provided. A polymeric film is disposed over the second surface of the die. An adhesive film is provided. The die and the polymeric film are attached to a carrier substrate through the adhesive film. The die, the polymeric film and the adhesive film are molded with a molding compound. The polymeric film is sandwiched between the die and the adhesive film upon attaching to the carrier substrate.

    Type: Application

    Filed: September 22, 2020

    Publication date: January 14, 2021

    Inventors: CHEN-SHIEN CHEN, MING-DA CHENG, MING-CHIH YEW, YU-TSE SU

  • Semiconductor packages having dummy connectors and methods of forming same

    Patent number: 10867976

    Abstract: An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

    Type: Grant

    Filed: December 11, 2019

    Date of Patent: December 15, 2020

    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventors: Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su, Sey-Ping Sun, Yang-Che Chen

  • Semiconductor package and method for manufacturing the same

    Patent number: 10797005

    Abstract: A semiconductor package includes a die including a first surface and a second surface opposite to the first surface, a warpage control unit disposed over the second surface of the die and entirely overlapping the second surface of the die, and a molding compound surrounding the die and the warpage control unit. The warpage control unit includes an adhesive portion disposed over the second surface of the die and a warpage adjustable portion sandwiched between the adhesive portion and the die.

    Type: Grant

    Filed: February 21, 2018

    Date of Patent: October 6, 2020

    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

    Inventors: Chen-Shien Chen, Ming-Da Cheng, Ming-Chih Yew, Yu-Tse Su

  • Semiconductor Packages Having Dummy Connectors and Methods of Forming Same

    Publication number: 20200118984

    Abstract: An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

    Type: Application

    Filed: December 11, 2019

    Publication date: April 16, 2020

    Inventors: Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su, Sey-Ping Sun, Yang-Che Chen

  • Semiconductor packages having dummy connectors and methods of forming same

    Patent number: 10510734

    Abstract: An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

    Type: Grant

    Filed: November 30, 2018

    Date of Patent: December 17, 2019

    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventors: Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su, Sey-Ping Sun, Yang-Che Chen

  • SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

    Publication number: 20190164907

    Abstract: A semiconductor package includes a die including a first surface and a second surface opposite to the first surface, a warpage control unit disposed over the second surface of the die and entirely overlapping the second surface of the die, and a molding compound surrounding the die and the warpage control unit. The warpage control unit includes an adhesive portion disposed over the second surface of the die and a warpage adjustable portion sandwiched between the adhesive portion and the die.

    Type: Application

    Filed: February 21, 2018

    Publication date: May 30, 2019

    Inventors: CHEN-SHIEN CHEN, MING-DA CHENG, MING-CHIH YEW, YU-TSE SU

  • Semiconductor packages having dummy connectors and methods of forming same

    Patent number: 10276548

    Abstract: An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

    Type: Grant

    Filed: August 4, 2017

    Date of Patent: April 30, 2019

    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventors: Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su, Sey-Ping Sun, Yang-Che Chen

  • Semiconductor Packages having Dummy Connectors and Methods of Forming Same

    Publication number: 20190115326

    Abstract: An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

    Type: Application

    Filed: November 30, 2018

    Publication date: April 18, 2019

    Inventors: Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su, Sey-Ping Sun, Yang-Che Chen

  • Semiconductor Packages having Dummy Connectors and Methods of Forming Same

    Publication number: 20180076184

    Abstract: An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

    Type: Application

    Filed: August 4, 2017

    Publication date: March 15, 2018

    Inventors: Chen-Shien Chen, Hsiu-Jen Lin, Ming-Chih Yew, Ming-Da Cheng, Yi-Jen Lai, Yu-Tse Su, Sey-Ping Sun, Yang-Che Chen

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